Innovation in Liquid Cooling in Singapore
Singapore will be one of COOLTECH’s next international stops. On September 29 and 30, we will participate in Data Center World Asia 2026, part of Tech Week Singapore, one of the APAC region’s premier events for digital infrastructure and data center.
COOLTECH will be present alongside HYDAC at booth Y45, where it will showcase its latest innovations in thermal management and direct liquid cooling.
Participating in Data Center World Asia represents an important opportunity to engage with industry professionals, decision-makers, and international companies in a market that is strategic for the development of next-generation digital infrastructure.
What we’re bringing to the booth:
- Next-gen liquid cooling technologies
- Infrastructure engineered for AI-ready systems
- Advanced solutions to manage increasing power densities efficiently
As data demands soar, optimizing cooling is no longer optional—it’s critical.
