LIQUID COLD-PLATES
LIQUID COLD-PLATES E WATER-BLOCKS
At the core of the COOLTECH product range are precision liquid cooling components, such as cold-plates and water-blocks. These components are engineered for use with power electronics, semiconductors, lasers, CPUs/GPUs, and any other high-density thermal sources. The result of in-depth R&D, each product offers high thermal performance, reliability and durability.
Our solutions can be seamlessly integrated into existing systems or custom-built to meet the specific requirements of your application. From the design of thermal and mechanical systems to material selection and in-house production, every step is carefully managed to ensure your systems operate at optimal temperatures, even under the most demanding conditions.
If you are interested in learning more about the performance range of our cold-plates:
POWER CONVERSION
Thermal management plays a crucial role in the efficiency, reliability and durability of power conversion systems. Our cold-plates meet the most complex cooling requirements, offering effective thermal dissipation.
Our solutions are optimised through CFD simulations and the selection of materials such as aluminium or copper. This means that they improve power density, reduce energy losses and extend the useful life of semiconductors such as IGBTs, MOSFETs and diodes. They also protect them from overheating. We can manufacture cold-plates in a variety of configurations, ranging from simple channels to complex geometries, using either Vacuum Brazing (VB) or Friction Stir Welding (FSW). We can also produce compact designs with bent and pressed tubes.
Integration into your modules is always optimal, thanks to a flexible design that is compatible with both standard and customised layouts. The entire process, from simulation to finished product, is overseen by our in-house team with an entirely custom-built approach.
ELECTRICAL TRACTIONS
In the electrical traction sector, effective temperature control is essential for ensuring autonomy, performance and safety. Our cold-plates provide high-performance liquid cooling for batteries, electric motors and inverters, which means they can manage high current flows under harsh operating conditions.
Controlling the temperature of each component is vital for maximising energy efficiency, extending the useful life of systems and preventing failures caused by overheating. Our designs marry advanced thermo-fluid dynamic simulations with lightweight, durable materials, offering solutions that are compatible with the most modern electric and hybrid vehicle architectures.
Configurations can range from extruded plates with integrated channels to brazed or pressed-tube solutions, and even to designs using die-cast components.
Cold-plates provide highly customisable mounting and connection options.
Drawing on our extensive experience, we are able to manufacture products that meet every technical and dimensional specification. We are committed to supporting the development of electric mobility with robust, reliable and high-performance solutions.
ENERGY STORAGE
In the rapidly growing field of energy storage systems, effective thermal management is essential for ensuring the safety, durability and efficiency of grid-scale applications and battery packs in residential and commercial settings. Our cold-plates are engineered to ensure batteries are maintained in ideal operating conditions at all times. This reduces the risk of thermal runaway and enhances long-term performance.
Our expertise allows us to develop custom-built solutions that are seamlessly compatible with cylindrical, pouch and prismatic cells, as well as any module configuration. We optimise every detail to ensure effective thermal dissipation. We intervene as early as the system design phase to consider manifolds, thermal interfaces and connections.
Our manufacturing capabilities are further bolstered by our use of advanced technologies such as Vacuum Brazing (VB), extrusion for efficient and scalable solutions, and advanced Friction Stir Welding (FSW) techniques. We select the most suitable process based on volume, cost and required specifications. Our cold-plates seamlessly integrate into the complete cooling system, creating robust, scalable and reliable thermal solutions that are ideal for next-generation storage.
THYRISTOR
Effective thermal management is vital for the operational stability of thyristors (SCRs, GTOs or IGCTs) in the field of high-voltage and high-current power electronics. Our cold-plates are designed to provide reliable, uniform cooling and prevent hot spots, maintaining stable temperatures even under conditions of high thermal stress.
We design solutions that are suitable for large modules and offer contact flatness and precise tolerances. This reduces the thermal resistance between the thyristor and the fluid. The internal geometries are optimised to promote heat exchange and flow turbulence, thus improving cooling efficiency.
Production is carried out using advanced techniques such as Vacuum Brazing (VB) and precision CNC machining, using corrosion-resistant and dielectrically compatible materials. We also offer support in the integration of manifolds and secondary circuits. This ensures that the cooling system is complete, stable and safe, even in the most demanding industrial environments.
SUPERCOMPUTING & DIRECT LIQUID COOLING
In the field of supercomputing, where computing density and thermal dissipation reach extreme levels, Direct Liquid Cooling (DLC) is the optimal solution to ensure consistent and reliable performance.
Our cold-plates and water blocks are engineered to ensure optimal temperature control for GPUs, CPUs, FPGAs and ASICs in state-of-the-art rack configurations.
We develop solutions that are fully compatible with the architectures of leading manufacturers, offering precise thermal interfaces and customised configurations, regardless of package complexity or power density. CFD simulations are used to optimise internal geometries. The design of channels and geometries is intended to maximise heat exchange and reduce losses.
We use high-performance materials and advanced manufacturing processes, such as Vacuum Brazing (VB), Friction Stir Welding (FSW) and high-precision CNC machining, to ensure flawless finishes and precise flatness. We also provide comprehensive support for system integration, from loop design to flow balancing. This enables us to create efficient and scalable systems that are ready for the future of High-Performance Computing.
SEMICONDUCTOR
In the semiconductor industry, effective thermal management is essential for ensuring the success of critical processes in the chip production chain. Our cold-plates are designed to deliver impeccable cooling throughout the production, testing and integration processes.
We specialise in providing cooling solutions for wafer chucks and substrates during deposition, etching and lithography processes. We also provide cooling solutions for high-power lasers used for precision cutting and packaging, as well as for high-frequency vision and testing systems. Our solutions guarantee thermal stability and precise control, which are essential for maintaining chip quality and increasing production yield.
We use materials that are compatible with ultra-clean environments, such as aluminium and stainless steel, which have been treated using advanced cleaning processes. Our components can be manufactured in a certified clean room, ready for integration into sensitive environments without the need for further cleaning. We use advanced cleaning processes to remove residues and improve corrosion resistance, ensuring our products meet the strict cleanliness standards required for direct interaction with wafers and sensitive devices.
Precision, purity and compatibility: everything you need to meet the thermal challenges of the semiconductor industry.